Apple has been pushing the envelope when it comes to their own silicon, with its internally designed SoC’s (System-on-a-chip) now found in almost all their products. While they are already powerful, there is still the potential to make them faster by adopting a smaller manufacturing process (meaning the transistors are smaller, hence more can be fit into the same area). Apple has said they won’t be moving to a new 3nm process on next year’s iPhone 14, sticking with the current 5nm process, but they are still developing the new 3nm tech platform.
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New reports claim that the new 3nm Apple silicon will be found in 2023’s iPhones and Mac products. Apple plans to continue working on the 3nm technology, despite the chip shortage issue that is currently affecting all industries and manufacturers around the world. The source mentions that Apple has plans to develop faster, and more efficient chipsets in the coming years.
The current M1, M1 Pro, and M1 Max chips are all fabricated on the 5-nanometer process, which has proven to be one of the most efficient and technologically advanced processes yet in a consumer electronics device.
As has been the case for years, Apple will partner with TSMC to produce its new chips. Apple is already outperforming the likes of Intel and AMD with its latest chips, and the report claims that if they crack the 3nm process this lead will just increase, which makes sense.
The iPhone is also expected to have massive improvements to both efficiency and performance. Although the report doesn’t mention the iPad line-up, we would also expect Apple to use the same chipsets as in the M1 laptops for the Pro models, and the same SoCs for the more affordable devices as in iPhones.
