In the fast paced world of mobile technology, different manufacturers try to find different ways to make their product stand out. Performance benchmarks on powerful processing units are one way of doing that, and it is the best way to compare processors across platforms.
However, one property of processors that has never had a real “˜reliable‘ test that has a huge impact on performance of both the processor and the device as a whole, is heat efficiency. Heat obviously slows the processing ability of a chip, but it has also been found that if the heat becomes extreme, it can even cause damage to other parts of a device and can warp batteries, reducing the longevity of your most prized device even further. Creating efficient chips is in everyone‘s best interest.
Qualcomm‘s Snapdragon S4 chip is widely regarded as one of the best and most powerful chips around. The 28nm chip has a great multitasking ability and can run high-end graphic intensive games. But they also believe it is one of the best heat efficient chips on the block. To prove their point, they have created a simple test. Placing a stick of butter on three phones all running different processors, their chip seems to run the coolest, with the butter on the Qualcomm chip melting the slowest.
It is a huge mess, to be honest, but it seems they are getting their point across. I‘m not sure this method of testing will actually catch on, though.
You can check out the video on YouTube here.
